Plating - Fluid Bed Electro-Plating Machine

Introduction
The Electro-Plating Machine Model FB201 is specially designed for electro-plating of surface mount electronic components, from 0402 to 1206 sizes. The patented fluid bed plating technology (U.S. Patent 6,228,230 B1) eliminates the use of media in plating of small parts. Such a feature reduces the electricity used in plating by 50% to 80% and completely eliminates the tedious work for media size control and maintenance. It also eliminates the problem of media and chip segregation that could reduce the plating uniformity. There are multiple cells in a tray. Each cell can be connected to or disconnected from the cathode. It provides the flexible for plating different lot size of chips and still maintains uniform plating conditions for each cell. The fluid agitation adopted in the plating machine provides uniform bath solution in the plating cells and results in dense and uniform metal deposit on the plated surface. Click here for printable version

Specifications

Dimensions   Inch mm Length 67 1710 Width 32 820 Height 37 940	Loading Capacity Chip Size Max. Loading (piece / batch) 0402 (1005) 2,500,000 0603 (1608) 366,000 0805 (2012) 90,000 1206 (3216) 54,000
Power supply for plating HP 6551A Power Supplier: Digital/Analog, Output 0-8V, 0-50A, Programming accuracy 5 mV, 60 mA, Ripple Voltage rms peak-peak – 3 mV, Ripple Current rms – 25 mA	Typical plating time and thickness (depend on bath condition) Material Plating Time (min/batch) Thickness (mm) Nickel 40-60 1.8-2.2 Solder 40-60 2.5-3.5
Weight (exclude bath solution) 470 lb or 213 kg	Loading volume for bath solution 22 gal or 82 liter
Filtration system Continuous operation glass filled polypropylene pump with high efficiency filter	Materials • Tank – polypropylene • Anode basket - Titanium
Power 208 V, 50/60Hz, max. 30A	Option items • Stainless steel electrical heater (2kw) and PID temperature controller • Mounted pH meter