The Electro-Plating Machine Model FB201 is specially designed for electro-plating of surface mount electronic components, from 0402 to 1206 sizes. The patented fluid bed plating technology (U.S. Patent 6,228,230 B1) eliminates the use of media in plating of small parts. Such a feature reduces the electricity used in plating by 50% to 80% and completely eliminates the tedious work for media size control and maintenance. It also eliminates the problem of media and chip segregation that could reduce the plating uniformity. There are multiple cells in a tray. Each cell can be connected to or disconnected from the cathode. It provides the flexible for plating different lot size of chips and still maintains uniform plating conditions for each cell. The fluid agitation adopted in the plating machine provides uniform bath solution in the plating cells and results in dense and uniform metal deposit on the plated surface.
Dimensions
| |
Inch |
mm |
| Length |
67 |
1710 |
| Width |
32 |
820 |
| Height |
37 |
940 |
|
Loading Capacity
Chip Size |
Max. Loading (piece / batch) |
0402 (1005) |
2,500,000 |
0603 (1608) |
366,000 |
0805 (2012) |
90,000 |
1206 (3216) |
54,000 |
|
Power supply for plating
HP 6551A Power Supplier:
Digital/Analog, Output 0-8V, 0-50A,
Programming accuracy 5 mV, 60 mA,
Ripple Voltage rms peak-peak – 3 mV,
Ripple Current rms – 25 mA |
Typical plating time and thickness (depend on bath condition)
| Material |
Plating Time (min/batch) |
Thickness (mm) |
| Nickel |
40-60 |
1.8-2.2 |
| Solder |
40-60 |
2.5-3.5 |
|
Weight (exclude bath solution)
470 lb or 213 kg |
Loading volume for bath solution
22 gal or 82 liter |
Filtration system
Continuous operation glass filled polypropylene pump with high efficiency filter |
Materials
• Tank – polypropylene
• Anode basket - Titanium |
Power
208 V, 50/60Hz, max. 30A |
Option items
• Stainless steel electrical heater (2kw) and PID temperature controller
• Mounted pH meter |
The Electro-Plating Machine Model FB201 is specially designed for electro-plating of surface mount electronic components, from 0402 to 1206 sizes. The patented fluid bed plating technology (U.S. Patent 6,228,230 B1) eliminates the use of media in plating of small parts. Such a feature reduces the electricity used in plating by 50% to 80% and completely eliminates the tedious work for media size control and maintenance. It also eliminates the problem of media and chip segregation that could reduce the plating uniformity. There are multiple cells in a tray. Each cell can be connected to or disconnected from the cathode. It provides the flexible for plating different lot size of chips and still maintains uniform plating conditions for each cell. The fluid agitation adopted in the plating machine provides uniform bath solution in the plating cells and results in dense and uniform metal deposit on the plated surface. 
© 2006 AEM, INC. •