Hi-Rel Services

Tin Whisker Mitigation - Adding Lead to Chip Size Components with Pure-Tin Terminals

Issues facing Hi Rel Product Manufacturers

• Traditional solder terminals with >3% lead is not prone to whiskering 
• Tin Whiskers tend to grow on pure-Tin terminated surfaces
• Whisker growth in Pure Tin Terminated components are unpredictable, and there is no accepted accelerated method to test for whiskering propensity
• Pure-Tin Terminated leaded components can be hot Sn-Pb Solder Dipped (though not always 100% effective)
• Pure-Tin terminated chip size components cannot be hot Tin-Lead Solder Dipped because of their very small sizes

Exclusive AEM Processes to add Lead to COTS Pure-Tin Terminals:

• Part of our AEM regular process of terminating chip size passive components to include capacitors, inductors, resistors, ferrite chip beads and fuses
• Processed components will be Up-screened (Groups A & B) and QCI performed
• Up screening and QCI can be per MIL STD 202, SCD, MIL Spec, etc.
• Processed and fully up-screened components will be warranted as AEM products
• Applicable to most multi-layer chip-size components. Other components may be processed subject to construction constraints