Hi-Rel Services

Tin Whisker Mitigation - Adding Lead to Chip Size Components with Pure-Tin Terminals

Click to download AEM TWM Service Datasheet(PDF)


Issues Facing Hi-Rel Product Manufacturers:

• Components with solder terminals comprised of >3% lead are not prone to Sn whisker problem.
• Whiskers tend to grow on 100% Sn surfaces.
• Whisker growth on 100% Sn terminated components is unpredictable, and there is no accepted accelerated method to test for whiskering propensity.
• Component with 100% Sn external terminals components can be hot Sn/Pb solder dipped, although not always 100% effective.
• 100% Sn terminated chip size style components should not be Sn/Pb hot solder dipped due to thermal shock concerns.

Exclusive AEM Sn/Pb Conversion Process Has Been Qualified by Major Aerospace OEMs:

• AEM Sn/Pb conversion process effective for most chip size passive components including capacitors, inductors, resistors, ferrite chip beads, fuses, resistor arrays, capacitor arrays, bead arrays, and many molded body passive and active surface mount component types.
• Sn/Pb processed components subjected to 100% visual and mechanical inspections per applicable EIA guidelines (includes sample solderability, leach resistance, terminal strength and DPA screening).
• Optional component up-screening and QCI also performed by AEM's MIL-STD-202 lab.
• Sn/Pb converted and up-screened components will be warranted as AEM products.
• AEM's Sn/Pb conversion process is applicable to most multi-layer chip style components. Other components may be processed subject to an AEM pre-evaluation and component construction analysis (generally performed by AEM at no cost to customer).